In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being challenged…read more
Thermal analysis moves into the 21st century
January 1st, 2000
Posted in Design, Software | No Comments »
Thermal characterization of active components
May 1st, 1999
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment)…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
January 1st, 1996
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more
Posted in Design, Software, Technical Brief, Test & Measurement | No Comments »
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