Posts tagged Dielectric

Thermally Conductive Epoxy

May 20th, 2011

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. This two component adhesive, sealant, and coating…read more

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Insulated Metal Printed Circuits – A User-Friendly Revolution In Power Design

November 1st, 2004

Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means…read more

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