Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures…read more
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
August 1st, 2004
Posted in Design, Test & Measurement | No Comments »
Highly emissive ion beam textured surfaces for improved cooling of electronic devices
September 1st, 1997
Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
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