Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more
Heat Spreading Calculations Using Thermal Circuit Elements
August 1st, 2008
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Thermal Strain in Semiconductor Packages, Part II
November 1st, 2007
Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Compact thermal modeling in electronics design
May 1st, 2007
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more
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A Funny Thing Happened On The Way To The Heatsink
August 1st, 2005
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more
Posted in Calculation Corner, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
May 1st, 2004
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermomechanical stress modeling in microelectronics and photonics
November 1st, 2001
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more
Posted in Design, Technical Brief, Test & Measurement | No Comments »
High accuracy thermal interface resistance measurement using a transient method
September 1st, 2000
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
A system level cooling solution for cellular phone applications
May 1st, 2000
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products…read more
Posted in Communications, Design, Materials, Compounds, Adhesives, Substrates, Power, Semiconductor, Test & Measurement | No Comments »
Safety tips and techniques for FEA in modeling solids
June 1st, 1995
Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful.…read more
Posted in Design, Software, Test & Measurement | No Comments »
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