Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level,…read more
Low Compression, High Performance Thermal Gap Filler
September 12th, 2011
Posted in Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Gap Filler Has Thermal Conductivity of 1.6 W/m-k
August 5th, 2011
T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is…read more
Posted in Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
- Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs
- APEC 2013: Applied Power Electronics Conference and Exhibition
- Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
- Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 9 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 9 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
