Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more
integrating vapor chambers into thermal solutions
April 30th, 2010
Posted in Applications, Heat Sinks, Technical Brief | 1 Comment »
Heat of Vaporization
August 1st, 2008
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more
Posted in Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »

