Cooler Master’s Hyper 212 EVO and Hyper TX3 EVO CPU Coolers have an improved tower fin design, heat pipe layout, upgraded fans and fan brackets. All of which provides an even more extreme value for…read more
Heat Sinks Feature Improved Tower Fin and Heat Pipe Layout
October 11th, 2011
Posted in Blowers / Fans / Filters, Heat Sinks, New Products | No Comments »
NASA Investigates Use of Heat Pipes on Space Station
June 28th, 2011
Scientists launched an investigation called the Constrained Vapor Bubble, or CVB, to the International Space Station to look into the operation of a heat pipe in space. The Constrained Vapor Bubble is the prototype for…read more
Posted in Aerospace, Heat Pipes, News | No Comments »
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Posted in Applications, Heat Pipes, Heat Sinks, New Products | No Comments »
Grapics Card Series Uses Heat Pipes to Cool GPU More Efficiently
October 25th, 2010
The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm PWM fan provides…read more
Posted in Heat Pipes, News | No Comments »
Austrian Company Acquires Electronic Component Producers
September 14th, 2010
Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics. EBG, based in Styria, Austria, is a…read more
Posted in Automotive, Industrial, News | No Comments »
Apple Gets Patent on Method of Cooling Electronic Devices
July 12th, 2010
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29,…read more
Posted in Consumer, Heat Pipes, Heat Sinks, News | No Comments »
Tiny Technology Making a Big Splash
April 12th, 2010
Thermacore, Inc., a provider of heat pipe technology and other thermal management solutions, announced that Thermacore Europe is making progress as lead partner of an 8.3 million euro ($11.4M) European research project, NanoHex. The team…read more
Posted in Applications, Liquid Cooling, News | No Comments »
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
November 1st, 2008
Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more
Posted in Heat Sinks, Technical Brief | No Comments »
Pushing the Boundaries of Heat Pipe Operation
November 1st, 2008
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more
Posted in Design, Heat Pipes | 1 Comment »
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
February 1st, 2005
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
Use Of Heat Pipe Cooling Systems In The Electronics Industry
November 1st, 2004
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
An Introduction to Pulsating Heat Pipes
May 1st, 2003
Modern electronics thermal management faces considerable challenges in the wake of component miniaturization, which has led to higher demands on net heat flux dissipation. With the industry closely following Moore’s Law, the future demands are…read more
Posted in Design, Heat Pipes, Liquid Cooling | No Comments »
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Posted in Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Semiconductor, Technical Brief | No Comments »
Heat pipe fundamentals
May 1st, 1999
The use of heat pipes in thermal management is increasing rapidly as power densities in electronics continue to rise. Heat pipes are attractive because they can typically carry 100 or more times as much heat…read more
Posted in Design, Heat Pipes, Test & Measurement | No Comments »
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