In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more
Future trends in heat sink design
February 1st, 2001
Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 1 Comment »
Heat pipes for electronics cooling applications
September 1st, 1996
Figure 1: Heat pipe operation Introduction All electronic components, from microprocessors to high end powerconverters, generate heat and rejection of this heat is necessary for theiroptimum and reliable operation. As electronic design allows higher throughputin…read more
Posted in Design, Heat Pipes, Test & Measurement | 6 Comments »
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