Elite Thermal Engineering (ETE) introduces turnkey cooling systems for fiber coupled laser diodes produced by LIMO, Jenoptik, QPC and nLight. The cooling systems can also be customized for fiber coupled laser diodes manufactured by other…read more
Laser Cooling Systems Offer Heatsink Module
January 25th, 2011
Posted in Heat Sinks, New Products | No Comments »
New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
Posted in Industries, New Products, Power | No Comments »
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
Posted in Calculation Corner, Data Centers, Editorial, Heat Sinks, Liquid Cooling, Technical Brief, Technical Data | 1 Comment »
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
December 6th, 2010
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more
Posted in Calculation Corner, Heat Sinks | No Comments »
SynJet Technology Helps Europe Go Green
November 22nd, 2010
Nuventix, Inc. announced it is seeing significant adoption of its SynJet technology across Europe, most notably in store installations of the region’s largest retailer. SynJet LED coolers maximize lumen output and extend the life of…read more
Posted in Heat Sinks, LED / Lighting, New Products, News | No Comments »
Analysis System Ensures Optimal Heat Sink Efficiency
October 25th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers…read more
Posted in Heat Sinks, New Products, Semiconductor | No Comments »
High Power Drives Raise Standards for Heat Management
October 11th, 2010
Danfoss has expanded its range of VLT drives with power capabilities up to 1.2MW. Drive voltage ratings range from 380VAC through 690VAC. A back-channel cooling method solves the heat loss problem by exhausting the majority…read more
Posted in Heat Sinks, New Products | No Comments »
Reinforced TIM Integrates Nylon Mesh Layer
September 28th, 2010
Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more
Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor | No Comments »
System Measures Pressure Distribution between Heat Sinks, Components
September 27th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source.…read more
Posted in Heat Sinks, New Products, Test & Measurement | No Comments »
Cooling High-Power Electronic Components in Small Packages
September 14th, 2010
Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance found in solid heat sink construction, which enables lower device temperature and greater component reliability. The chamber features…read more
Posted in Coolers, Heat Sinks, New Products | 1 Comment »
Heat Sinks Contribute to Cool Silence
July 27th, 2010
Silent-cooled graphics cards are becoming increasingly prevalent as PC hardware is becoming increasingly efficient. In silent cooling, a heat sink is installed in a model that engineers determine can remain safely cool without a fan.…read more
Posted in Computer, Heat Sinks, News | No Comments »
New Instrument System Enables Precise Air Flow
July 26th, 2010
Advanced Thermal Solutions, Inc. (ATS) has introduced the iTHERM-100 Test Station, a turnkey system of laboratory instruments and sensors for studies that require precise air flow velocity and temperature measurement. Applications include thermal management studies…read more
Posted in New Products, Test & Measurement | No Comments »
Apple Gets Patent on Method of Cooling Electronic Devices
July 12th, 2010
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29,…read more
Posted in Consumer, Heat Pipes, Heat Sinks, News | No Comments »
Heat Sink Reliability Risks from Thermal Greases
May 25th, 2010
ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the use of thermal greases as thermal interface materials. The implications…read more
Posted in Applications, Heat Sinks, News, TIMs | No Comments »
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