The new R2 Series of heat sinks from Ohmite combines thermal performance with the attachment mechanism of the popular C Series. This heat sink is capable of attaching either a TO-220 or a TO-247 component…read more
Heat Sinks Designed for Higher Power Densities
January 9th, 2012
Posted in Heat Sinks, New Products | No Comments »
Bristly Particles Could Manage Heat Flow in Electronics
October 25th, 2011
A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles…read more
Posted in Heat Sinks, News | No Comments »
New Heat Sink Series with Push Pin Mounting System
July 11th, 2011
Advanced Thermal Solutions, Inc.’s new series of its maxiFLOW™ heat sinks now include an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components Each heat…read more
Posted in Heat Sinks, New Products | No Comments »
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Posted in Applications, Heat Pipes, Heat Sinks, New Products | No Comments »
Thermal Grease Provides Thermal Conductivity, Electronic Insulation
October 25th, 2010
Shenzhen Halnziye Electronics Co., Ltd., offers heat sink compounds Thermal Grease Provides Thermal Conductivity, Electronic Insulation, heat sink plaster, heat sink flow and thermal pads. Shenzhen Halnziye’s thermal grease provides high quality thermal conductivity, electronic…read more
Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products | 1 Comment »
Thermal Grease Screen Printers
August 23rd, 2010
Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen…read more
Posted in Automotive, Computer, Consumer, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Thermal Gap Fillers Combine High Performance, Low Pricing
August 23rd, 2010
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more
Posted in Communications, Consumer, New Products | No Comments »
integrating vapor chambers into thermal solutions
April 30th, 2010
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more
Posted in Applications, Heat Sinks, Technical Brief | 1 Comment »
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
August 1st, 2008
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more
Posted in Heat Sinks, Technical Brief, Test & Measurement | No Comments »
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
February 1st, 2008
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more
Posted in Calculation Corner, Design, Heat Sinks | No Comments »
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