Clemens J.M. Lasance Philips Research Laboratories Emeritus The last time the subject of my column was: ‘Most of us don’t live in wind tunnels, neither in the world of Nusselt.’ I promised more comments about…read more
thermal facts and fairy tales: fully-developed channel flow: why is Nu constant?
September 13th, 2010
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Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
May 1st, 2005
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting…read more
Posted in Calculation Corner, Design, Heat Sinks, Test & Measurement | No Comments »
The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling
February 1st, 2004
The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal…read more
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Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
February 1st, 2003
As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of…read more
Posted in Calculation Corner, Design, Heat Sinks | 1 Comment »
Estimating Natural Convection Heat Transfer for Arrays of Vertical Parallel Flat Plates
February 1st, 2002
A simple formula to estimate the natural convection heat transfer coefficient on a flat plate was presented in a preceding column [1]. If, instead of a single plate, we wish to consider a closely spaced…read more
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Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
August 1st, 2001
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more
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Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications
August 1st, 2001
The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic…read more
Posted in Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates | No Comments »
Don’t underestimate radiation in electronic cooling
February 1st, 2001
don’t underestimate radiation in electronics cooling Bruce M. Guenin, Ph.D., Associate Editor, Amkor Technology, Inc. It is easy to underestimate the role of thermal radiation as a significant contributor to electronics cooling in environments without…read more
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Temperature of in-line array of electronic components simulated by rectangular blocks
May 1st, 2000
An earlier work by the authors (Molki et al., 1995) discussed the adiabatic heat transfer coefficient of rectangular blocks situated in an in-line array. In real circuit boards, heat is generated by a number of…read more
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Evaluation of different heat transfer coefficient definitions
June 1st, 1995
The analysis of convective heat transfer problems pivots on the accurate knowledge of the heat transfer coefficient, h. The heat transfer coefficient is affected by many parameters which have been defined differently by various investigators.…read more
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