Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more
Thermal Challenges In LED Cooling
November 1st, 2006
Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, TECs, Test & Measurement | 1 Comment »
Exploring the Limits of Air Cooling
August 1st, 2006
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more
Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Liquid Cooling, Semiconductor, Test & Measurement | No Comments »
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
A Funny Thing Happened On The Way To The Heatsink
August 1st, 2005
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more
Posted in Calculation Corner, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Vibration Analysis For Electronic Equipment
August 1st, 2005
This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the…read more
Posted in Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Server Design Challenges for the High-heat-load Internet Data Center
February 1st, 2005
Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example,…read more
Posted in Blowers / Fans / Filters, Computer, Coolers, Data Centers, Design, Heat Sinks, Test & Measurement | No Comments »
Solve Thermal Issues Earlier in Updated Board Designs
February 1st, 2005
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded;…read more
Posted in Computer, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
May 1st, 2004
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more
Posted in Aerospace, Communications, Defense, Design, Heat Sinks, Power, Test & Measurement, TIMs | No Comments »
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | No Comments »
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