Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more
Forced Convection Heat Sink Thinner than a Credit Card
May 23rd, 2011
Posted in Heat Sinks, New Products | No Comments »
Compact Water-Circulation System Prevents Stacks of Electronic Chips
May 25th, 2010
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from…read more
Posted in Applications, Computer, Coolers, Industries, Liquid Cooling, News | No Comments »
±0.5% Tolerance Chip NTC Thermistors
May 10th, 2010
Murata Electronics North America added the ±0.5% tolerance option to its NCP series negative temperature coefficient (NTC) thermistor line. The ultra-tight tolerance thermistor is offered for consumer, industrial and automotive temperature ranges (-40°C to +150°C),…read more
Posted in Applications, Automotive, Consumer, Industrial, Industries, New Products, Software | No Comments »
Solid-State Microrefrigerator on a Chip
August 1st, 2006
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more
Posted in Coolers, Design, Semiconductor | No Comments »
Integrated Circuit Package Types And Thermal Characteristics
February 1st, 2006
Introduction Integrated circuits range in power consumption from mW (or maybe microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to over 1,000. With such…read more
Posted in Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Advanced Techniques for IC Surface Temperature Measurement
February 1st, 2002
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard…read more
Posted in Design, Test & Measurement | No Comments »
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
May 1st, 2000
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more
Posted in Calculation Corner, Computer, Design, Semiconductor, Test & Measurement | No Comments »
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