Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | No Comments »
Thermal Calculations for Multi-chip Modules
November 1st, 2002
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC…read more
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »
The increasing importance of thermal test dies
September 1st, 2000
Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
January 1st, 1996
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more
Posted in Design, Software, Technical Brief, Test & Measurement | No Comments »
Electronic package characterization per JEDEC standard
January 1st, 1996
Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The…read more
Posted in Design, Software, Test & Measurement | No Comments »
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