Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the…read more
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
May 1st, 2008
Posted in Design, LED / Lighting, Test & Measurement | 1 Comment »
How Much Heat can be Extracted from a Heat Sink?
May 1st, 2003
Thermal transport from a heat sink creates a unique condition in heat transfer and fluid flow once it is placed on a PCB in an unducted fluid flow delivery system. Although a heat sink may…read more
Posted in Design, Heat Sinks, Test & Measurement | No Comments »
Thermal Issues in GaAs Analog RF Devices
February 1st, 2002
Wireless communication and advanced radar systems require circuitry that can operate at frequencies greater than 2 GHz and at high power levels. Analog gallium arsenide (GaAs) semiconductors are frequently used in these applications and present…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
September 1st, 2000
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over…read more
Posted in Calculation Corner, Computer, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
May 1st, 2000
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more
Posted in Calculation Corner, Computer, Design, Semiconductor, Test & Measurement | No Comments »
Determining the junction temperature in a plastic semiconductor package, part II
September 1st, 1999
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In…read more
Posted in Calculation Corner, Design, Plastics, Semiconductor, Test & Measurement | No Comments »
Determining the junction temperature in a plastic semiconductor package, part 1
May 1st, 1999
One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Plastics, Semiconductor, Test & Measurement | No Comments »
Electrical temperature measurement using semiconductors
January 1st, 1997
Introduction Semiconductor junctions offer many useful properties including inherentcharacteristics which are well suited to temperature measurement. Within theelectronics cooling arena, these properties form the basis for “theelectrical method of junction temperature measurement” and are used…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Recent Posts
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- Look for the March issue of Electronics Cooling featuring the 2012 Buyers' Guide - Subscribe today - http://t.co/RGtouuDk #
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
