Posts tagged Material Properties

Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Posted in Applications, Ceramics, Design, Materials, Compounds, Adhesives, Substrates, Plastics, Technical Data, Test & Measurement | No Comments »

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