Taica’s Alpha Gel’s softness and conformity help minimize heat resistance and stress on critical devices in electronics. K thermal-conductivity material is available, facilitating heat dissipation results. The gel retains the softness and tackiness of its…read more
Thermal Conductive Materials & EM Noise Absorbents
March 22nd, 2011
Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | 1 Comment »
diary dates
September 13th, 2010
Some important 2010 events in the electronic thermal management community. Visit us online at www.electronics-cooling.com for the latest listings. Advanced Technology Workshop and Tabletop Exhibition on Thermal Management • WHEN: Sept. 28-30 • WHERE: Dinah’s…read more
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Energy Efficiency Reshapes Thermal Management Challenges
June 21st, 2010
Electronic equipment manufacturers are increasingly more focused on achieving high efficiency levels for their circuit designs in response to global concerns about the impact on the environment. However, the thermal benefits of high efficiency circuit…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Heat Conducting Graphene Could Cool Electronics
June 7th, 2010
Multiple layers of graphene show strong heat conducting properties that can be harnessed in removing dissipated heat from electronic devices, a team of scientists from the University of California reported in a recently published paper…read more
Posted in Applications, Computer, Industries, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Thermoelectricity: Turning Temperature Differences Directly into Electricity
June 7th, 2010
The fundamental problem in creating efficient thermoelectric materials is that they need to be good at conducting electricity, but not at conducting thermal energy, say Massachusetts Institute of Technology (MIT) researchers. That way, one side…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
"Revolutionary" New Thermal Management Materials
May 1st, 2005
Editors tend to frown on use of “revolutionary” in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
High performance thermal management materials
September 1st, 1999
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
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