A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively…read more
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
March 30th, 2010
Posted in Applications, Liquid Cooling, News | No Comments »
A Practical Implementation Of Silicon Microchannel Coolers
November 1st, 2007
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were…read more
Posted in Coolers, Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
On-Chip Electrowetting Cooling
May 1st, 2006
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the…read more
Posted in Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Posted in Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Semiconductor, Technical Brief | No Comments »
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