Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more
Forced Convection Heat Sink Thinner than a Credit Card
May 23rd, 2011
Posted in Heat Sinks, New Products | No Comments »
Novel Thermally Enhanced Power Package
January 25th, 2011
In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path…read more
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IMAPS Honors Member with President’s Award
December 14th, 2010
Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with IMAPS’ 2010 President’s Award for dedicated efforts in ensuring a successful reorganization of the IMAPS Microelectronics Foundation and increasing its financial resources. IMAPS (International Microelectronics…read more
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Advanced Techniques for IC Surface Temperature Measurement
February 1st, 2002
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard…read more
Posted in Design, Test & Measurement | No Comments »
The Many Flavors of Ball Grid Array Packages
February 1st, 2002
By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price.…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Thermomechanical stress modeling in microelectronics and photonics
November 1st, 2001
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more
Posted in Design, Technical Brief, Test & Measurement | No Comments »
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
Posted in Communications, Computer, Coolers, Data Centers, Design, Heat Sinks, IT Products, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Power, Semiconductor | No Comments »
Direct liquid immersion cooling for high power density microelectronics
May 1st, 1996
Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears,…read more
Posted in Computer, Coolers, Design, Liquid Cooling, Test & Measurement | No Comments »
How to select a heat sink
June 1st, 1995
With the increase in heat dissipation from microelectronics devices and thereduction in overall form factors, thermal management becomes a more a moreimportant element of electronic product design. Both the performance reliability and life expectancy of…read more
Posted in Design, Heat Sinks, Semiconductor, Test & Measurement | No Comments »
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