Avionics systems designers and systems integrators are faced with the challenge of size, weight, and power (SWaP) constraints. Commercial, business, and military aviation customers increasingly desire modern avionics—whether installing in new aircraft platforms, or retrofitting…read more
Thermal and Power Management in Airborne Platforms
November 22nd, 2011
Posted in Aerospace, Defense, News | No Comments »
Defense Systems Summit
August 22nd, 2011
Sept. 7, Arlington, Va. This free 1-day event is dedicated to the protection of our country’s critical warfare computing environments. You’ll learn strategies and best practices for securing command IT systems and get tactics for…read more
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New 1.3M pixel, Mil-Hardened 1280 x 1024 Shortwave Infrared (SWIR) Camera
May 20th, 2011
Goodrich ISR Systems’ new 1.3 Mpixel, indium gallium arsenide (InGaAs) video camera, the GA-1280J-15A, offers the highest sensitivity available in a military-hardened NIR-SWIR camera. The new, high-resolution J-Series SWIR camera features 1280 x 1024 pixels,…read more
Posted in Defense, New Products | No Comments »
30 GHz Leadless Chip Carrier Packaging Platform
March 18th, 2011
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more
Posted in Aerospace, Ceramics, Defense, Design | No Comments »
Cold Plates for Demanding Military Cooling Applications
March 18th, 2011
Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers…read more
Posted in Coolers, Defense | No Comments »
Thermal Gap Filler Wins Editor’s Choice Award
February 21st, 2011
The Tflex™ XS400 Series thermal gap filler won Military Embedded Systems Magazine’s Editor’s Choice award for November/December. The Tflex™ XS400 Series received the award for its commercial, off-the-shelf (COTS) properties, which makes it well-suited for…read more
Posted in Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Military Electronics Thermal Management Challenges Spark Innovation
November 9th, 2010
Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight…read more
Posted in Aerospace, Defense, News | No Comments »
Military Issues Press for New Materials Development
August 10th, 2010
Pressing needs for new ways to cool electronics for aerospace and defense applications are encouraging the development of new materials to wick heat away from components on boards and in chassis, and also is providing…read more
Posted in Aerospace, Defense, News | No Comments »
Electronics Cooling for Military Environments
May 25th, 2010
Allen Vanguard’s Electronic Protection with Integrated Cooling (EPIC) is a customized E-cooling system that protects electronic systems from the severe heat and harsh operating environments found in military environments, including vehicle electronics. It complies with…read more
Posted in Defense, Industries, New Products | No Comments »
Direct Spray Cooling and System-level Comparisons
August 1st, 2009
Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a…read more
Posted in Aerospace, Applications, Defense, Design, Industries, Liquid Cooling | No Comments »
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