Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Posted in Calculation Corner, Data Centers, Editorial, Heat Sinks, Liquid Cooling, Technical Brief, Technical Data | 1 Comment »
Keeping Moore’s Law Alive
December 6th, 2010
Peter E. Raad Southern Methodist University and TMX Scientific, Inc., Dallas, Texas A recent news item [1] described the intended efforts of researchers from IBM, EPFL, and ETH to “keep Moore’s Law for another 15…read more
Posted in News | No Comments »
The Uses of Simplicity in Thermal Analysis
July 26th, 2010
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system…read more
Posted in Applications, Computer, Industries, Software | No Comments »
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
March 30th, 2010
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively…read more
Posted in Applications, Liquid Cooling, News | No Comments »
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
February 1st, 2009
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more
Posted in Design, Semiconductor | No Comments »
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