Posts tagged Performance Figure of Merit

Toward A Thermal Figure Of Merit For Multi-Chip Packages

November 1st, 2006

Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more

Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | 1 Comment »

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