Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty…read more
Companies Announce Partnership for Global Distribution
November 21st, 2011
Posted in News, TIMs | No Comments »
Low Resistance, Zero Pump-Out Thermal Pad
March 18th, 2011
AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more
Posted in Materials, Compounds, Adhesives, Substrates | No Comments »
Phase Change Material Thermal Properties
May 1st, 2005
Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink.…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, TIMs | No Comments »
Thermal management of outdoor enclosures using phase change materials
January 1st, 1998
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and…read more
Posted in Aerospace, Communications, Data Centers, Design, IT Products, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
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