SinkPAD Corporation’s new SinkPADTM aluminum PCB technology are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications. SinkPADTM conducts heat out of…read more
Thermal Management PCBs Solve Thermal Problems for LED Industry
June 13th, 2011
Posted in LED / Lighting, New Products | No Comments »
New PCB Heater Assemblies for Low Temperature Applications
December 14th, 2010
Spectrum Sensors & Controls has developed a new series of printed circuit board (PCB) heater assemblies for use in applications where sensitive electronics need to operate at very cold temperatures, or where electronics need a…read more
Posted in New Products | No Comments »
Thermally Conductive Printed Circuit Board Substrate
April 27th, 2010
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate…read more
Posted in Applications, Computer, Industries, LED / Lighting, Materials, Compounds, Adhesives, Substrates, New Products | 2 Comments »
Vibration Analysis For Electronic Equipment
August 1st, 2005
This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the…read more
Posted in Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Characterizing a package on a populated printed circuit board
May 1st, 2001
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Visualization of air flows in electronics systems
May 1st, 2001
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Conduction heat transfer in a printed circuit board
May 1st, 1998
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 1 Comment »
Recent Posts
- New Business Development Specialist Seeks Position
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