Posts tagged printed materials

New Family of Highly Thermally-Conductive Bonding Materials

May 22nd, 2012

Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications. THERCOBOND™ materials are specially designed for power electronic device packaging and…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off

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