Posts tagged Problems

Problems with Thermal Interface Material Measurements: Suggestions for Improvement

November 1st, 2003

Preface Increasingly it is apparent that measuring the thermal properties of Thermal Interface Materials (TIMs) causes much irritation for vendors and users alike. This article focuses on various measurement and standardization aspects and offers a…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »

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