Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more
Thermal Challenges In LED Cooling
November 1st, 2006
Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, TECs, Test & Measurement | 2 Comments »
Thermal Conductivity of III-V Semiconductors
February 1st, 2006
Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed “III-V” have desirable electrical properties…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data, Test & Measurement | No Comments »
High Resolution, Real Time Micro-thermal Imaging — Steady State and Pulse Measurements on Microscopic Semiconductor Targets
February 1st, 2002
Thermal imaging of microscopic targets has evolved over the past 20 years to the point where real time “true-temperature” mapping with 50 milliKelvin sensitivity and 2.75 �m spatial resolution is possible. Recently, the capability to…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Brief, Test & Measurement | No Comments »
The submerged double jet impingement (SDJI) method for thermal testing of packages
May 1st, 2001
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is…read more
Posted in Design, Test & Measurement | No Comments »
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
September 1st, 2000
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over…read more
Posted in Calculation Corner, Computer, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
May 1st, 2000
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more
Posted in Calculation Corner, Computer, Design, Semiconductor, Test & Measurement | No Comments »
The history of power dissipation
January 1st, 2000
Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore’s prediction. In his fascinating book, “Visions,” Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Thermal characterization of active components
May 1st, 1999
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment)…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Packaging: designing for thermal performance
May 1st, 1997
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been…read more
Posted in Design | No Comments »
Electrical temperature measurement using semiconductors
January 1st, 1997
Introduction Semiconductor junctions offer many useful properties including inherentcharacteristics which are well suited to temperature measurement. Within theelectronics cooling arena, these properties form the basis for “theelectrical method of junction temperature measurement” and are used…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
How to select a heat sink
June 1st, 1995
With the increase in heat dissipation from microelectronics devices and thereduction in overall form factors, thermal management becomes a more a moreimportant element of electronic product design. Both the performance reliability and life expectancy of…read more
Posted in Design, Heat Sinks, Semiconductor, Test & Measurement | 1 Comment »
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