Pentair Technical Products announces a fully featured, expanded line of Hoffman™ brand ZONEX™ ATEX-Certified* Enclosures. ZONEX hinge-cover and screw-cover enclosures are designed for use in applications where “increased safety” protection (Ex e), as defined by…read more
Enclosure Models Meet European ATEX Directive
March 26th, 2012
Posted in Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
New Graphene Material Conducts Heat Faster than Silicon
January 17th, 2012
A new graphene material capable of conducting heat 20 times faster than silicon could make the next generation of electronic devices quieter and longer-lasting. The experimental graphene made by U.S. and Chinese researchers has also…read more
Posted in News, TIMs | No Comments »
Companies Team Up to Develop Adhesives to Create 3D Semiconductors
September 27th, 2011
3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will…read more
Posted in Materials, Compounds, Adhesives, Substrates, News, Semiconductor | No Comments »
Side-View LED Manufacturing Wins Two Technology Innovation Awards
June 13th, 2011
Nordson ASYMTEK earned two awards for innovative technology during NEPCON China 2011. Both the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine were presented to Nordson ASYMTEK…read more
Posted in LED / Lighting, News | 1 Comment »
Hot STM Captures Thermal Decomposition in situ at the Nanoscale
May 10th, 2011
A new report in the journal Nanotechnology offers findings of a nanoscale in situ investigation of ultrathin silicon oxide thermal decomposition by high temperature scanning tunneling microscopy. A surface chemical reaction—the thermal decomposition of ultrathin…read more
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Internal Combustion Used to Make Metal Oxide Thin-Film Electronics
April 22nd, 2011
As amorphous silicon electronics reach their physical limits, researchers at Northwestern University have figured out a way to make amorphous oxides cheaply and reliably. Amorphous oxides are faster than amorphous silicon and also easier to…read more
Posted in Materials, Compounds, Adhesives, Substrates, News | No Comments »
what’s happening
September 13th, 2010
Melting-While-Cooling Silicon Could Improve Solar Cells Researchers at the Massachusetts Institute of Technology (MIT) have recently discovered that by dissolving certain metals into silicon, they can add that silicon compound to the relatively short list…read more
Posted in Computer, Consumer, Coolers, LED / Lighting, News | No Comments »
Melting-While-Cooling Silicon Could Improve Solar Cells
August 10th, 2010
Researchers at the Massachusetts Institute of Technology (MIT) have recently discovered that by dissolving certain metals into silicon, they can add that silicon compound to the relatively short list of exotic substances that exhibit retrograde…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Compact Water-Circulation System Prevents Stacks of Electronic Chips
May 25th, 2010
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from…read more
Posted in Applications, Computer, Coolers, Industries, Liquid Cooling, News | No Comments »
Power Map Calculations Using Image Sources and Superposition
November 1st, 2008
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »
A Practical Implementation Of Silicon Microchannel Coolers
November 1st, 2007
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were…read more
Posted in Coolers, Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
May 1st, 2006
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data | No Comments »
The thermal conductivity of silicon
May 1st, 1998
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required.…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
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