ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original…read more
Providing More Value Than Playing Video Games
November 1st, 2007
Posted in Design, Editorial | No Comments »
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »
Use of junction-to-board thermal resistance in predictive engineering
January 1st, 1999
The readers of “Electronics Cooling” are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you…read more
Posted in Design, Test & Measurement | No Comments »
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