Posts tagged Substrate

X-Ray Diffraction Reveals 3D Mechanics of Germanium-Crystal Arrays

April 27th, 2012

Scientists at the European Synchrotron Radiation Facility (ESRF) are using X-ray diffraction to thoroughly understand a new type of nanostructure — square arrays of germanium (Ge) pillars that have very complex geometries and physical attributes.…read more

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Connector/Decoupler Integrated in a Heat Sink

April 11th, 2011

United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more

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30 GHz Leadless Chip Carrier Packaging Platform

March 18th, 2011

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more

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Breakthrough Thermal Material System to Enable Faster Computing

March 18th, 2011

Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices,…read more

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Thermally Conductive Printed Circuit Board Substrate

April 27th, 2010

Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate…read more

Posted in Applications, Computer, Industries, LED / Lighting, Materials, Compounds, Adhesives, Substrates, New Products | 2 Comments »

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Multilayer circuitry on metal substrates

September 1st, 2000

Today’s electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling…read more

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