Scientists at the European Synchrotron Radiation Facility (ESRF) are using X-ray diffraction to thoroughly understand a new type of nanostructure — square arrays of germanium (Ge) pillars that have very complex geometries and physical attributes.…read more
X-Ray Diffraction Reveals 3D Mechanics of Germanium-Crystal Arrays
April 27th, 2012
Posted in News, Test & Measurement | No Comments »
Connector/Decoupler Integrated in a Heat Sink
April 11th, 2011
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more
Posted in Heat Sinks, News | No Comments »
30 GHz Leadless Chip Carrier Packaging Platform
March 18th, 2011
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more
Posted in Aerospace, Ceramics, Defense, Design | No Comments »
Breakthrough Thermal Material System to Enable Faster Computing
March 18th, 2011
Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices,…read more
Posted in Computer, Materials, Compounds, Adhesives, Substrates | No Comments »
Thermally Conductive Printed Circuit Board Substrate
April 27th, 2010
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate…read more
Posted in Applications, Computer, Industries, LED / Lighting, Materials, Compounds, Adhesives, Substrates, New Products | 2 Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
- Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs
- APEC 2013: Applied Power Electronics Conference and Exhibition
- Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
- Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
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