Posts tagged Superposition Method

So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages

August 1st, 2006

Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more

Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »

Tags: , , , ,