Power IQ 2.0 Energy Management software provides Thermal Analytics for monitoring rack temperatures based on industry guidelines. Trending reports and cumulative totals can be displayed at the data center, floor, room, rack, customer and IT…read more
Energy Management Software Helps Data Centers Conserve Energy
February 21st, 2011
Posted in CFD Software, Data Centers, New Products | No Comments »
The Uses of Simplicity in Thermal Analysis
July 26th, 2010
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system…read more
Posted in Applications, Computer, Industries, Software | No Comments »
IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
Posted in Applications, New Products, Semiconductor, Software | No Comments »
Use of Power Law Regression in Packaging Thermal Calculations
August 1st, 2009
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such…read more
Posted in Applications, Calculation Corner, Design, Test & Measurement | No Comments »
Simple Formulas for Estimating Thermal Spreading Resistance
May 1st, 2004
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source and a sink with different cross-sectional…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Characterizing a package on a populated printed circuit board
May 1st, 2001
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal analysis moves into the 21st century
January 1st, 2000
In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being challenged…read more
Posted in Design, Software | No Comments »
Measuring fluid velocity in electronic enclosures
January 1st, 1998
Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of measurement becomes a challenge since we are…read more
Posted in Design, Test & Measurement | No Comments »
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