Mentor Graphics is offering a new web-based tool for thermal characterization and design of semiconductor packages. FloTHERM® IC reduces the time spent on thermal characterization and design by providing an automated process that includes pre-verified…read more
Semiconductor Package Thermal Characterization and Design
February 24th, 2010
Posted in New Products | No Comments »
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | No Comments »
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, IT Products, Medical, Power, Semiconductor, Test & Measurement | No Comments »
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
May 1st, 2008
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the…read more
Posted in Design, LED / Lighting, Test & Measurement | 1 Comment »
Reliability Testing Of Thermal Greases
November 1st, 2007
Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more
Posted in Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Optical instrumentation for the thermal characterization of electronic devices
August 1st, 2002
What information does light, reflected from a running electronic device, carry? Our research team has been working upon this key question for almost a decade. As this magazine is dedicated to thermal issues, we will…read more
Posted in Design, Test & Measurement | No Comments »
Characterizing a package on a populated printed circuit board
May 1st, 2001
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
The submerged double jet impingement (SDJI) method for thermal testing of packages
May 1st, 2001
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is…read more
Posted in Design, Test & Measurement | No Comments »
Component thermal characterization
February 1st, 2001
For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an…read more
Posted in Design, Test & Measurement | No Comments »
Thermal characterization of power ICs using virtual junction temperature
February 1st, 2001
Thermal experts generally view thermal resistance as a measurable property of a semiconductor device. A system designer, who designs an appliance, is usually not a thermal expert. The system designer just needs a way to…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
May 1st, 2000
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more
Posted in Calculation Corner, Computer, Design, Semiconductor, Test & Measurement | No Comments »
Thermal characterization of active components
May 1st, 1999
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment)…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Standardizing heat sink characterization for forced convection
September 1st, 1997
Figure 1. Wind tunnel configuration Introduction While there has been a flurry of activity inliterature addressing the behavior of heat sinks in computer electronics,the reusability of the data presented in these papers has been somewhatlimited…read more
Posted in Design, Heat Sinks, Test & Measurement | No Comments »
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