Posts tagged Thermal Characterization

Semiconductor Package Thermal Characterization and Design

February 24th, 2010

Mentor Graphics is offering a new web-based tool for thermal characterization and design of semiconductor packages. FloTHERM® IC reduces the time spent on thermal characterization and design by providing an automated process that includes pre-verified…read more

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LED Thermal Standardization: A Hot Topic

May 9th, 2009

Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more

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Numerical Simulation of Complex Submicron Devices

May 1st, 2009

Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more

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On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages

May 1st, 2008

Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the…read more

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Reliability Testing Of Thermal Greases

November 1st, 2007

Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more

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Metals For Thin Wires – Criteria Of Choice

August 1st, 2005

When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and…read more

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Optical instrumentation for the thermal characterization of electronic devices

August 1st, 2002

What information does light, reflected from a running electronic device, carry? Our research team has been working upon this key question for almost a decade. As this magazine is dedicated to thermal issues, we will…read more

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Characterizing a package on a populated printed circuit board

May 1st, 2001

This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the…read more

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The submerged double jet impingement (SDJI) method for thermal testing of packages

May 1st, 2001

Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is…read more

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Component thermal characterization

February 1st, 2001

For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an…read more

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Thermal characterization of power ICs using virtual junction temperature

February 1st, 2001

Thermal experts generally view thermal resistance as a measurable property of a semiconductor device. A system designer, who designs an appliance, is usually not a thermal expert. The system designer just needs a way to…read more

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Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter

May 1st, 2000

In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more

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Thermal characterization of active components

May 1st, 1999

In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment)…read more

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Standardizing heat sink characterization for forced convection

September 1st, 1997

Figure 1. Wind tunnel configuration Introduction While there has been a flurry of activity inliterature addressing the behavior of heat sinks in computer electronics,the reusability of the data presented in these papers has been somewhatlimited…read more

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