Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The…read more
Electronic package characterization per JEDEC standard
January 1st, 1996
Posted in Design, Software, Test & Measurement | No Comments »
Recent Posts
- Researchers Control Heat Flow with Atoms
- SEMICON West 2012
- Summer Heat Transfer Conference
- IMS2012 International Microwave Symposium
- Multi-Port Cages with Thermal Management
- 55°C Cooling Performance Thin-Film Thermoelectric Coolers
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
- Significant Changes to the NFPA 70E Standard 2012 Edition
Latest Issue
Don’t miss out on
the March 2012 issue
of Electronics Cooling, which includes the 2012 Buyers' Guide as well as features on ionic winds, heat spreading, thermal ground plane technology, and microchannel cooling.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- Heat pipes for electronics cooling applications 7 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on using thermocouples 5 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- All you need to know about fans 1 comment(s)
- Air Flow through Cooling Technology for Aerospace Systems - http://t.co/MhAiN39R #
- Still Haven’t Downloaded the Electronics Cooling Buyers’ Guide App? Download it today & see what you are missing - http://t.co/slVy0vYX #
- Cold Atoms Simulate Graphene - http://t.co/acjUaMBp #
- Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power & Packaging Density Electronic Systems - http://t.co/uZ4Czy5S #
