Byron Blackmore Mentor Graphics Corporation Introduction Thermal conduction into a printed circuit board (PCB) is often an important part of the critical heat transfer path in electronic devices. Efficiently capturing the effect of the heterogeneous…read more
creating PCB thermal conductivity maps using image processing
September 13th, 2010
Posted in | 1 Comment »
Thermal Gap Fillers Combine High Performance, Low Pricing
August 23rd, 2010
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more
Posted in Communications, Consumer, New Products | No Comments »
Thermal Facts and Fairy Tales: Uncertainty is Assured
July 26th, 2010
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of…read more
Posted in Applications, Design, Materials, Compounds, Adhesives, Substrates | No Comments »
High-Performance Thermal Putty
May 10th, 2010
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Technical Data Summary
August 1st, 2009
ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more
Posted in Applications, Ceramics, Design, Materials, Compounds, Adhesives, Substrates, Plastics, Technical Data, Test & Measurement | No Comments »
Thermal conductivity of common alloys in electronics packaging
February 1st, 2007
Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data | No Comments »
Thermal Conductivity of Solders
August 1st, 2006
Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more
Posted in Materials, Compounds, Adhesives, Substrates, Technical Data | 1 Comment »
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
May 1st, 2006
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data | No Comments »
Thermal Conductivity of III-V Semiconductors
February 1st, 2006
Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed “III-V” have desirable electrical properties…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data, Test & Measurement | No Comments »
Seven Years Of Technical Data: An Overview
November 1st, 2004
The first 1997 issue of ElectronicsCooling started with a Technical Data column, the first of a still continuing series of columns devoted to data that are of interest to thermal designers. In the author’s opinion,…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
Use Of Heat Pipe Cooling Systems In The Electronics Industry
November 1st, 2004
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
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