Posts tagged Thermal Interface aterials

Packaging Challenges For High Heat Flux Devices

August 1st, 2006

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »

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