Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board…read more
High accuracy thermal interface resistance measurement using a transient method
September 1st, 2000
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Calculating interface resistance
May 1st, 1997
Figure 1. Ceramic Package – Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today’s high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks…read more
Posted in Ceramics, Design, Heat Sinks, Test & Measurement | No Comments »
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