Daat Research’s CoolitDC handles complex facility shapes, raised floors, drop ceilings, room partitions, support columns, under floor pipes, cables and obstructions, furniture and other infrastructure components. It also accounts for room ventilation components such as…read more
New CFD Data Center Software
May 5th, 2011
Posted in CFD Software, Data Centers, New Products | No Comments »
SpaceClaim Signs OEM Contract with C&R Technologies
March 4th, 2011
C&R Technologies (CRTech) has chosen SpaceClaim to be integrated within the CRTech family of products. CRTech SpaceClaim will address complexities in creating thermal models by enabling users to import CAD parts and assemblies from many…read more
Posted in CFD Software, New Products | No Comments »
Thermal Modeling Approaches Of GaAs Semiconductors
February 1st, 2008
Introduction Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
May 1st, 2004
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
EMC and Thermal Design Conflicts in a PC
November 1st, 2002
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are…read more
Posted in Design, Test & Measurement | No Comments »
Thermal joint conductance for graphite materials
August 1st, 2002
The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Thermal Issues in GaAs Analog RF Devices
February 1st, 2002
Wireless communication and advanced radar systems require circuitry that can operate at frequencies greater than 2 GHz and at high power levels. Analog gallium arsenide (GaAs) semiconductors are frequently used in these applications and present…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Thermomechanical stress modeling in microelectronics and photonics
November 1st, 2001
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more
Posted in Design, Technical Brief, Test & Measurement | No Comments »
Component thermal characterization
February 1st, 2001
For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an…read more
Posted in Design, Test & Measurement | No Comments »
The treacherous streams
February 1st, 2001
During the development of a telecommunications product, an unpredictable phenomenon of air streams within the maze of cards and module was encountered. It could only be compared to suddenly confronting powerful inner streams in a…read more
Posted in Blowers / Fans / Filters, Design, Heat Sinks, Test & Measurement | No Comments »
Use of junction-to-board thermal resistance in predictive engineering
January 1st, 1999
The readers of “Electronics Cooling” are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you…read more
Posted in Design, Test & Measurement | No Comments »
Integrated thermal network models are still useful
September 1st, 1997
Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the…read more
Posted in Design | No Comments »
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