In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over…read more
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
September 1st, 2000
Posted in Calculation Corner, Computer, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
Thermal testing and control by means of built-in temperature sensors
September 1st, 1998
Introduction This paper will discuss a new approach to the measurement of the thermal properties of PCBs and the packages mounted to them. It is intended to replace traditional solutions, such as using thermocouples and…read more
Posted in Blowers / Fans / Filters, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
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