Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q” Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w…read more
Indirect Thermosyphons For Cooling Electronic Devices
February 1st, 2006
Posted in Design, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
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