Nextreme Thermal Solutions’ thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.…read more
Thin-Film Thermoelectrics with Improved Cooling Efficiency
February 7th, 2012
Posted in New Products, TECs | No Comments »
Researcher Receives IEEE Field Award
June 13th, 2011
Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging, has been honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and Manufacturing Technologies. The award recognizes…read more
Posted in News | No Comments »
Internal Combustion Used to Make Metal Oxide Thin-Film Electronics
April 22nd, 2011
As amorphous silicon electronics reach their physical limits, researchers at Northwestern University have figured out a way to make amorphous oxides cheaply and reliably. Amorphous oxides are faster than amorphous silicon and also easier to…read more
Posted in Materials, Compounds, Adhesives, Substrates, News | No Comments »
Solid-State Microrefrigerator on a Chip
August 1st, 2006
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more
Posted in Coolers, Design, Semiconductor | No Comments »
Recent Posts
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
- Cooling Semiconductor with Laser Light
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
- Read about a 40 GHz bandwidth socket for 16x16mm, 0.8mm pitch packages - http://t.co/2HUoSENS #
