Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to…read more
Gap Filler Pad with Low-Tac Top Surface
October 11th, 2011
Posted in New Products, TIMs | No Comments »
Graphics Card with Thermal Design Offers Quiet Performance
February 4th, 2011
Graphics card and mainboard manufacturer MSI recently unveiled its N560GTX-Ti Twin Frozr II/OC graphics card featuring the Twin Frozr II Thermal Design. An appraisal by BenchmarkReviews.com determined that “the Twin Frozr II cooling system is…read more
Posted in Computer, New Products | No Comments »
Making Sure Your Chips Don’t Burn
September 28th, 2010
Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most…read more
Posted in Computer, Coolers, News, Semiconductor, TIMs | No Comments »
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
February 1st, 2009
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today’s high-performance TIMs…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »
Direct Die Attach Using a Room Temperature Soldering Process
May 1st, 2006
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance…read more
Posted in Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Brief | No Comments »
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
May 1st, 2004
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more
Posted in Aerospace, Communications, Defense, Design, Heat Sinks, Power, Test & Measurement, TIMs | No Comments »
Thermal Interface Materials: A Brief Review of Design Characteristics and Materials
February 1st, 2004
Introduction In the past few decades, as microprocessors have continued to evolve along Moore’s law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Problems with Thermal Interface Material Measurements: Suggestions for Improvement
November 1st, 2003
Preface Increasingly it is apparent that measuring the thermal properties of Thermal Interface Materials (TIMs) causes much irritation for vendors and users alike. This article focuses on various measurement and standardization aspects and offers a…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Thermal Interface Materials
November 1st, 2003
It doesn’t take long for an electronics assembler to realize that a thermal interface material (TIM) is essential when two or more solid surfaces are in the heat path. Standard machined surfaces are rough and…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Calculations for Thermal Interface Materials
August 1st, 2003
It’s no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Understanding Phase Change Materials
May 1st, 2002
Although phase change materials (PCM) were introduced nearly twenty years ago, it was not until the development of the high-powered Pentium processor that this class of interface material gained widespread acceptance. The large quantities of…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement, TIMs | No Comments »
Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
May 1st, 1999
All phase change thermal interface materials are designed to minimize the thermal resistance in an interface between a heat generating component and a heat sink. How well they achieve this goal in a specific application…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Thermal Interface Materials
September 1st, 1996
Thermattach thermally conductive adhesivetapes Introduction Today’s semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Recent Posts
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
- Cooling Semiconductor with Laser Light
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
- Read about a 40 GHz bandwidth socket for 16x16mm, 0.8mm pitch packages - http://t.co/2HUoSENS #
