Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner article will address the use of interdigitated fins to provide a mechanically tolerant thermal path between two opposing surfaces (e.g., the back … [Read more...]
Archives for 2008
en Route to a Greener Thermal Technology
It's no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer architects have responded by designing systems that use multi-core processors. These processors can use less energy to perform the same workload as their single-core brethren by … [Read more...]
Challenges In Thermal Management Of Memory Modules
The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as equally important; another 21% indicated that cooling was their major challenge; and 12% cited power consumption as a big concern [2]. Another … [Read more...]
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