As electronic applications become more sophisticated and higher performing, the need for thermal performance that can keep pace is increasing. Parker is excited to continue pushing the bar and helping their customers accelerate innovation with THERM-A-GAP GEL 120 which offers a game-changing thermal conductivity of 12.0 W/m-K. THERM-A-GAP GEL 120 is a one-component, … [Read more...]
Sheetak Solves Micro-Scale Hotspots with New µCENTUM™ Thermoelectric Coolers
High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX - To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact solid-state devices deliver powerful, component-level cooling to uphold … [Read more...]
Sheetak Expands Thermoelectric Offering with New TEG Solutions for Energy Harvesting Applications
Solid-state power generation modules enable reliable, compact energy sources for remote and rugged environments. AUSTIN, TX – Sheetak Inc., a U.S.-based leader in thermoelectric innovation, is expanding its product line with a new range of thermoelectric generators (TEGs), offering reliable, solid-state energy harvesting for applications where conventional power sources fall … [Read more...]
Airsys Introduces the PowerOne™ AI-Era Cooling Solutions for Modern Data Centers
As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
Gates Strengthens Data Center Portfolio with Launch of Data Master™ Eco
Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, reduce environmental impact and meet the complex AI-enabling, data … [Read more...]
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