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14th International Conference and Exhibition on DEVICE PACKAGING

06marAll Day0814th International Conference and Exhibition on DEVICE PACKAGING

Event Details

The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

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Time

march 6 (Tuesday) - 8 (Thursday) PST(GMT+00:00)

Location

WekoPa Resort and Casino

10438 N Fort McDowell Rd, Fort McDowell, AZ 85264