GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium - Small Systems Integration. We invite you to join us for this two-day event on September 5-6,
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium – Small Systems Integration.
We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.
This symposium brings together leaders in academia, industry, and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.
There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.
The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and has become an integral member in advancing the field of electronics packaging.
Session topics for 2019 :
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
We hope to see you there.
5 (Thursday) 1:00 am - 6 (Friday) 1:00 am
Niskayuna, New York