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BEGIN:VEVENT
UID:69d4f6a1b7f84
DTSTAMP:20260407T122049Z
DTSTART:20180918
DTEND:20180919
LOCATION:Binghamton\,  NY
SUMMARY:Electronics Packaging Symposium
DESCRIPTION:The 30th annual Binghamton University and GE Electronics Packag
 ing Symposium\,  the premier electronics manufacturing conference in the No
 rtheast\,  features more than 40 invited technical presentations by academi
 c\,  industry\,  and government leaders\,  influencers\,  and decision make
 rs. The program includes an IEEE Electronics Packaging Society-sponsored wo
 rkshop on Heterogeneous Integration\,  a student poster[..]\nhttps://www.el
 ectronics-cooling.com/events/electronics-packaging-symposium/
URL:https://www.electronics-cooling.com/events/electronics-packaging-symposium/
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