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BEGIN:VEVENT
UID:6a63e1bf8c09a
DTSTAMP:20260724T220551Z
DTSTART:20261026
DTEND:20261027
LOCATION:San Diego\,  CA
SUMMARY:InterPACK 2026
DESCRIPTION:As the flagship conference of the ASME Electronic and Photonic 
 Packaging Division (EPPD)\,  InterPACK brings together the full systems eco
 system — from advanced materials and thermal management to next‑generat
 ion computing architectures and intelligent\,  connected devices.\nhttps://
 www.electronics-cooling.com/events/interpack-2026/
URL:https://www.electronics-cooling.com/events/interpack-2026/
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