Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting…read more
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
February 1st, 2005
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more
Simple Formulas for Estimating Thermal Spreading Resistance
May 1st, 2004
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source and a sink with different cross-sectional…read more
Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
February 1st, 2004
In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by…read more
Estimating Parallel Plate-fin Heat Sink Pressure Drop
May 1st, 2003
In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the…read more
Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
February 1st, 2003
As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of…read more
Estimating Temperatures in a Water-to-Air Hybrid Cooling System
May 1st, 2002
As most readers are no doubt aware, the trend towards ever increasing processor module power is making it more and more difficult to cool directly with air. Many thermal engineers are convinced that water cooling…read more
Estimating Natural Convection Heat Transfer for Arrays of Vertical Parallel Flat Plates
February 1st, 2002
A simple formula to estimate the natural convection heat transfer coefficient on a flat plate was presented in a preceding column [1]. If, instead of a single plate, we wish to consider a closely spaced…read more
Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
August 1st, 2001
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more
Application of thermoelectric coolers for module cooling enhancement
May 1st, 2000
Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These…read more
A simple method to estimate heat sink air flow bypass
May 1st, 1997
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in…read more
Direct liquid immersion cooling for high power density microelectronics
May 1st, 1996
Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears,…read more
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