Introduction As power-component technology advances and smaller packaging is required, thermal-management issues threaten to limit the performance of devices. As power dissipation rises, the inability to cool them may force designers to de-rate the devices’ performance by reducing current or switching speed and/or employing higher-voltage devices that are less efficient and … [Read more...]
Sheetak Announces Product Line Expansion with CENTUM® C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures
CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Arieca Announces an Agreement to Develop a Liquid-Metal-Based Thermal Interface Material for Power Modules in the Electric Vehicle (xEV) Segment
May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to develop next-generation TIM using Arieca’s Liquid Metal Embedded Elastomer(LMEE) Technology. This … [Read more...]
Neograf Solutions’ New Advanced Graphenes Targets Energy Storage Markets
NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheet and powder products, has extended its range of next-generation graphite materials with the launch of Graf-X™ graphene nanoplatelets (GNP) and graphene precursors (GP). Both high-performance additive materials deliver enhanced strength, performance, and reliability in … [Read more...]
New fanSINKS Cool Hot Components in Sizes from 27mm to 70mm
Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKS™ heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications. ATS fanSINKS™ feature cross-cut, straight aluminum fins. They … [Read more...]
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